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LDO设计论文

LDO设计论文

半导体工艺和器件仿真工具Silvaco TCAD

半导体工艺和器件仿真工具Silvaco TCAD

Microsoft Word - LNA.doc

Microsoft Word - LNA.doc

compact trimming design of a high precision reference

compact trimming design of a high precision reference

电路

RISC-V手册

RISC-V手册

Silicon-Germanium Heterojunction Bipolar Transistors (2002)

Silicon-Germanium Heterojunction Bipolar Transistors (2002)

无线通信中的射频收发系统设计（英文版）

无线通信中的射频收发系统设计（英文版）

Laker-Sansen-Design of Analog Integrated Circuits and Systems (1994)

Laker-Sansen-Design of Analog Integrated Circuits and Systems ...

相位噪声、通行链路预算

相位噪声、通行链路预算

Design considerations of recent advanced low-voltage low-temperature-coefficient CMOS bandgap voltage reference - Custom Integrated Circuits Conference, 2004. Proceedings of the IEEE 2004

Design considerations of recent advanced low-voltage low-temperature-c[..] ...

ISSCC2021-T8-On-Chip Interconnects Basic Concepts, Designs, and Future Opportunities

ISSCC2021-T8-On-Chip Interconnects Basic Concepts, Designs, ...

模拟集成电路设计与仿真何乐年

模拟集成电路设计与仿真何乐年

Assura Physical Verifica tion User Guide

Assura Physical Verifica tion User Guide

Inc. Cadence Design Sys tems

基于CMOS工艺的ESD器件及全芯片防护设计

基于CMOS工艺的ESD器件及全芯[..]

CMOS模拟IP线性集成电路

CMOS模拟IP线性集成电路

集成电路掩模设计－基础版图技术

集成电路掩模设计－基础版图技术

Leblebici D. Fundamentals of High-FrequencyAnalog IC 2ed 2021

Leblebici D. Fundamentals of High-FrequencyAnalog IC 2ed 2021

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IEEE Std 802.11ac™-2013, IEEE Standard for Information technology—Telecommunications and information exchange between systems—Local and metropolitan area networks—Specific requirements—Part 11: Wireless LAN Medium Access Control (MAC) and Physical Layer (PHY) specifications—Amendment 4: Enhancements for Very High Throughput for Operation in Bands below 6 GHz

IEEE Std 802.11ac™-2013, IEEE Standard for Information technology—Teleco[..] ...

LAN/MAN Standards Committee of the IEEE Computer Society